Search results for: microelectronics-packaging-handbook

Microelectronics Packaging Handbook

Author : Rao Tummala
File Size : 70.10 MB
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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Microelectronics Packaging Handbook

Author : R.R. Tummala
File Size : 73.43 MB
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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Electronic Materials Handbook

Author :
File Size : 58.82 MB
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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Handbook of Microelectronics Packaging and Interconnection Technologies

Author : F. N. Sinnadurai
File Size : 55.89 MB
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Microelectronics Packaging Handbook

Author : Rao Tummala
File Size : 70.31 MB
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Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging

Microelectronic Packaging Technology

Author : Wei T. Shieh
File Size : 35.24 MB
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Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

Fundamentals of Microsystems Packaging

Author : Tummala
File Size : 75.71 MB
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"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing"

Hybrid Microelectronics Handbook

Author : Jerry E. Sergent
File Size : 77.41 MB
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Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.

Area Array Packaging Handbook

Author : Ken Gilleo
File Size : 58.54 MB
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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Materials Developments in Microelectronic Packaging

Author : Prabjit Singh
File Size : 21.43 MB
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The proceedings of the Fourth Electronic Materials and Processing Conference, held in Montreal in 1991, cover the latest developments in multichip modules, surface mount technology, microelectronic interconnections, electronic and fiber optic connectors, and microelectronic corrosion in 53 papers. I

Electronic Packaging and Interconnection Handbook

Author : Charles A. Harper
File Size : 25.87 MB
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Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field

Handbook of Fiber Optic Data Communication

Author : Casimer DeCusatis
File Size : 48.1 MB
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The Handbook includes chapters on all the major industry standards, quick reference tables, helpful appendices, plus a new glossary and list of acronyms. This practical handbook can stand alone or as a companion volume to DeCusatis: Fiber Optic Data Communication: Technological Advances and Trends (February 2002, ISBN: 0-12-207892-6), which was developed in tandem with this book. * Includes emerging technologies such as Infiniband, 10 Gigabit Ethernet, and MPLS Optical Switching * Describes leading edge commercial products, including LEAF and MetroCore fibers, dense wavelength multiplexing, and Small Form Factor transceiver packages * Covers all major industry standards, often written by the same people who designed the standards themselves * Includes an expanded listing of references on the World Wide Web, plus hard-to-find references for international, homologation, and type approval requirements * Convenient tables of key optical datacom parameters and glossary with hundreds of definitions and acronyms * Industry buzzwords explained, including SAN, NAS, and MAN networking * Datacom market analysis and future projections from industry leading forecasters

Manufacturing Processes and Materials Challenges in Microelectronic Packaging

Author : American Society of Mechanical Engineers. Winter Meeting
File Size : 40.47 MB
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Plastic Packaging of Microelectronic Devices

Author : Louis T. Manzione
File Size : 90.47 MB
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ASM Handbook

Author : ASM International. Handbook Committee
File Size : 79.77 MB
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This volume is a comprehensive reference on the basic concepts, methodologies, and information sources dealing with materials selection and its integration with engineering design processes. Contents include contributions from 100+ experts involved with design, materials selection, and manufacturing. Addresses metals, ceramics, polymers, and composites and provides many case histories and examples.

Multichip Module Technology Handbook

Author : Philip E. Garrou
File Size : 61.81 MB
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Multichip Modules (MCMs) are increasingly in the mainstream of electronics design due to both their falling prices and increasing demands for speed and performance. Endorsed by the International Microelectronics and Packaging Society (IMAPS), this handbook will serve as the standard MCM reference for the electronics industry. It provides complete guidance on how to design, manufacture, assemble, test, and inspect the MCMs of today and tomorrow. Focus on application of MCMs to industry design problems accompanies analysis of the pros and cons of ceramic, deposited, and laminate MCMs. Other key topics include tech drivers--MCM electrical performance--large area processing--3D packaging--module-to-board interconnection--high clock rate systems--known good die (KGD)--and thermal issues.

Handbook of Electronic Package Design

Author : Michael Pecht
File Size : 86.57 MB
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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Area Array Interconnection Handbook

Author : Karl J. Puttlitz
File Size : 42.29 MB
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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Proceedings of the 1991 International Symposium on Microelectronics October 21 23 1991 Orange County Convention Center Orlando Florida

Author :
File Size : 30.97 MB
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Handbook of Electronic Packaging

Author : Charles A. Harper
File Size : 70.72 MB
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