Search results for: design-for-manufacturability-and-statistical-design

Design for Manufacturability and Statistical Design

Author : Michael Orshansky
File Size : 87.83 MB
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Design for Manufacturability and Statistical Design: A Comprehensive Approach presents a comprehensive overview of methods that need to be mastered in understanding state-of-the-art design for manufacturability and statistical design methodologies. Broadly, design for manufacturability is a set of techniques that attempt to fix the systematic sources of variability, such as those due to photolithography and CMP. Statistical design, on the other hand, deals with the random sources of variability. Both paradigms operate within a common framework, and their joint comprehensive treatment is one of the objectives of this book and an important differentation.

Design for Manufacturability and Statistical Design

Author : Michael Orshansky
File Size : 77.77 MB
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Design for Manufacturability and Statistical Design: A Comprehensive Approach presents a comprehensive overview of methods that need to be mastered in understanding state-of-the-art design for manufacturability and statistical design methodologies. Broadly, design for manufacturability is a set of techniques that attempt to fix the systematic sources of variability, such as those due to photolithography and CMP. Statistical design, on the other hand, deals with the random sources of variability. Both paradigms operate within a common framework, and their joint comprehensive treatment is one of the objectives of this book and an important differentation.

Nano CMOS Design for Manufacturability

Author : Ban P. Wong
File Size : 70.28 MB
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Discover innovative tools that pave the way from circuit and physical design to fabrication processing Nano-CMOS Design for Manufacturability examines the challenges that design engineers face in the nano-scaled era, such as exacerbated effects and the proven design for manufacturability (DFM) methodology in the midst of increasing variability and design process interactions. In addition to discussing the difficulties brought on by the continued dimensional scaling in conformance with Moore's law, the authors also tackle complex issues in the design process to overcome the difficulties, including the use of a functional first silicon to support a predictable product ramp. Moreover, they introduce several emerging concepts, including stress proximity effects, contour-based extraction, and design process interactions. This book is the sequel to Nano-CMOS Circuit and Physical Design, taking design to technology nodes beyond 65nm geometries. It is divided into three parts: Part One, Newly Exacerbated Effects, introduces the newly exacerbated effects that require designers' attention, beginning with a discussion of the lithography aspects of DFM, followed by the impact of layout on transistor performance Part Two, Design Solutions, examines how to mitigate the impact of process effects, discussing the methodology needed to make sub-wavelength patterning technology work in manufacturing, as well as design solutions to deal with signal, power integrity, WELL, stress proximity effects, and process variability Part Three, The Road to DFM, describes new tools needed to support DFM efforts, including an auto-correction tool capable of fixing the layout of cells with multiple optimization goals, followed by a look ahead into the future of DFM Throughout the book, real-world examples simplify complex concepts, helping readers see how they can successfully handle projects on Nano-CMOS nodes. It provides a bridge that allows engineers to go from physical and circuit design to fabrication processing and, in short, make designs that are not only functional, but that also meet power and performance goals within the design schedule.

Design for Manufacturability

Author : Artur Balasinski
File Size : 75.55 MB
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This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

VLSI Design for Manufacturing Yield Enhancement

Author : Stephen W. Director
File Size : 62.60 MB
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One of the keys to success in the IC industry is getting a new product to market in a timely fashion and being able to produce that product with sufficient yield to be profitable. There are two ways to increase yield: by improving the control of the manufacturing process and by designing the process and the circuits in such a way as to minimize the effect of the inherent variations of the process on performance. The latter is typically referred to as "design for manufacture" or "statistical design". As device sizes continue to shrink, the effects of the inherent fluctuations in the IC fabrication process will have an even more obvious effect on circuit performance. And design for manufacture will increase in importance. We have been working in the area of statistically based computer aided design for more than 13 years. During the last decade we have been working with each other, and individually with our students, to develop methods and CAD tools that can be used to improve yield during the design and manufacturing phases of IC realization. This effort has resulted in a large number of publications that have appeared in a variety of journals and conference proceedings. Thus our motivation in writing this book is to put, in one place, a description of our approach to IC yield enhancement. While the work that is contained in this book has appeared in the open literature, we have attempted to use a consistent notation throughout this book.

Process Variations and Probabilistic Integrated Circuit Design

Author : Manfred Dietrich
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Uncertainty in key parameters within a chip and between different chips in the deep sub micron area plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process. Quantitative methodology is needed to ensure faultless functionality, despite existing process variations within given bounds, during product development. This book presents the technological, physical, and mathematical fundamentals for a design paradigm shift, from a deterministic process to a probability-orientated design process for microelectronic circuits. Readers will learn to evaluate the different sources of variations in the design flow in order to establish different design variants, while applying appropriate methods and tools to evaluate and optimize their design.

Integrated Circuit and System Design Power and Timing Modeling Optimization and Simulation

Author : Rene van Leuken
File Size : 62.54 MB
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This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.

Offsite Production and Manufacturing for Innovative Construction

Author : Jack S. Goulding
File Size : 52.4 MB
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The offsite and modular market is continuing to grow. This book builds on the success of a number of initiatives, including formative findings from literature, research and development and practice-based evidence (success stories). It presents new thinking and direction from leading experts in the fields of: design, process, construction, engineering, manufacturing, logistics, robotics, delivery platforms, business and transformational strategies, change management, legislation, organisational learning, software design, innovation and biomimetics. This book is particularly novel and timely, as it brings together a number of cogent subjects under one collective ‘umbrella’. Each of these chapters contain original findings, all of which culminate in three 'Key Learning Points' which provide new insight into the cross-cutting themes, interrelationships and symbiotic forces that exist between each of these chapters. This approach also provides readers with new contextualised understanding of the wider issues affecting the offsite market, from the need to embrace societal challenges, through to the development of rich value-laden solutions required for creating sector resilience. Content includes a balance between case studies and practice-based work, through to technical topics, theoretical propositions, pioneering research and future offsite opportunities ready for exploitation. This work includes: stakeholder integration, skills acquisition, new business models and processes, circularity and sustainable business strategies, robotics and automation, innovation and change, lean production methodologies and new construction methods, Design for Manufacturing and Assembly, scaled portfolio platforms and customisability, new legal regulatory standards and conformance issues and offsite feasibility scenario development/integration.

Introducing Technology Computer Aided Design TCAD

Author : Chinmay K. Maiti
File Size : 52.80 MB
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This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of major state-of-the-art stress- and strain-engineered advanced semiconductor devices: MOSFETs, BJTs, HBTs, nonclassical MOS devices, finFETs, silicon-germanium hetero-FETs, solar cells, power devices, and memory devices. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including design for manufacturing (DFM), and from device modeling to SPICE parameter extraction. The book also offers an innovative and new approach to teaching the fundamentals of semiconductor process and device design using advanced TCAD simulations of various semiconductor structures. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. To extend the role of TCAD in today’s advanced technology era, process compact modeling and DFM issues have been included for design–technology interface generation. Unique in approach, this book provides an integrated view of silicon technology and beyond—with emphasis on TCAD simulations. It is the first book to provide a web-based online laboratory for semiconductor device characterization and SPICE parameter extraction. It describes not only the manufacturing practice associated with the technologies used but also the underlying scientific basis for those technologies. Written from an engineering standpoint, this book provides the process design and simulation background needed to understand new and future technology development, process modeling, and design of nanoscale transistors. The book also advances the understanding and knowledge of modern IC design via TCAD, improves the quality in micro- and nanoelectronics R&D, and supports the training of semiconductor specialists. It is intended as a textbook or reference for graduate students in the field of semiconductor fabrication and as a reference for engineers involved in VLSI technology development who have to solve device and process problems. CAD specialists will also find this book useful since it discusses the organization of the simulation system, in addition to presenting many case studies where the user applies TCAD tools in different situations.

Analysis and Design of Machine Elements

Author : Vijay Kumar Jadon
File Size : 30.36 MB
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The book covers fundamental concepts, description, terminology, force analysis and methods of analysis and design. The emphasis in treating the machine elements is on methods and procedures that give the student competence in applying these to mechanical components in general. The book offers the students to learn to use the best available scientific understanding together with empirical information, good judgement, and often a degree of ingenuity, in order to produce the best product. Few unique articles e.g., chain failure modes, lubrication of chain drive, timing belt pulleys, rope lay selection, wire rope manufacturing methods, effect of sheave size etc., are included. Friction materials are discussed in detail for both wet and dry running with the relevant charts used in industry. Design of journal bearing is dealt exhaustively. Salient Features: " Compatible with the Machine Design Data Book (same author and publisher). " Thorough treatment of the requisite engineering mechanics topics. " Balance between analysis and design. " Emphasis on the materials, properties and analysis of the machine element. " Material, factor of safety and manufacturing method are given for each machine element. " Design steps are given for all important machine elements. " The example design problems and solution techniques are spelled out in detail. " Objective type, short answer and review problems are given at the end of each chapter. " All the illustrations are done with the help of suitable diagrams. " As per Indian Standards.